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Imec imec | 17-02-2010

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Green radios
Imec's innovative 40nm beamforming circuitry
>  Novel beamforming- and ADC solution for 60GHz
 
EUV lithography
ASML EUV tool at imec
>  Imec is world leading in EUV mask defectivity assessment
 
Organic electronics
Analog organic electronic ADC on flexible foil
>  Analog organic electronic ADC on flexible foil
 

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Imec presented novel beamforming- and ADC solution for 60GHz at ISSCC 2010

Imec's innovative 40nm beamforming circuitry.
Imec's innovative 40nm beamforming circuitry.
At the International Solid State Circuit Conference (ISSCC 2010 – San Francisco, 7-11 February), imec has presented several innovative solutions for 60GHz communication. One innovation concerns a programmable analog baseband beamformer for a 4-antenna 60GHz phased-array receiver. A second solution is a very fast low-resolution 4-way interleaved analog-to-digital (ADC) converter. Both solutions have been designed in 40nm digital CMOS.

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Imec is world leading in EUV mask defectivity assessment

By using a unique combination of 3 inspection techniques (blank inspection, patterned mask inspection and wafer inspection), imec is able to evaluate the defectivity level of state-of-the-art reticles for extreme ultraviolet lithography (EUVL). This mask defectivity investigation is crucial for preparing EUVL for high-volume manufacturing.

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Example of a natural defect found on an EUV reticle that prints severely.
Example of a natural defect found on an EUV reticle that prints severely.
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Analog organic electronic ADC on flexible foil

Analog organic ADC on flexible foil.
Analog organic ADC on flexible foil.

Holst Centre, imec, TNO and K.U.Leuven present an analog-to-digital converter (ADC) designed, fabricated and measured in an organic technology on plastic foil. The result is of great scientific value as it represents the first steps of creating analog organic electronics.

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Medicine goes digital

With our Human++ research at imec and Holst Centre, we more and more succeed in creating technology that fits the human body: ultrasmall, ultraflexible, intelligent systems. This is a very relevant technology, technology that can help people lead a healthier life. A technology also that is on the verge of a worldwide breakthrough.

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Terascale world map demonstrates scale reduction of Si photonics technology

Using CMOS fabrication tools, imec and its associated laboratory INTEC (Ghent University) have mapped out the whole world on a scale of 1 trillionth. The map is put on a Si photonic test chip designed for demonstrating optical waveguides with very low propagation loss. With this small world map the researchers have illustrated the scalability of the Si photonics technology, enabling more complex optical functions on a single chip for applications in telecommunication, high-speed computing, biotechnology and healthcare.

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Imec Technology Forum 2010 - PREVIEW

Consumers rarely think of all the ways that technology simplifies their lives. But imec and its partners are constantly monitoring problems and trends and thinking of solutions for each one. How are we going to develop a sustainable and prosperous world for the earth’s population in the 21st century? We are convinced that technology will play an essential role in finding solutions for climate change and the depletion of the earths sources (renewable energy), the ageing population and the rising costs of healthcare (biomedical electronics), sustainable mobility, efficient communication etc.
The Imec Technology Forum brings together executives from companies and institutes in Asia, Europe and the USA to discuss advances in nanotechnology for innovations targeting a better life in a sustainable society.

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Imec reports integration approach for high-mobility III-V/Ge MOSFETs

Imec presents a common gate stack (CGS) solution to integrate high-mobility Ge pMOSFETs and InGaAs nMOSFETs. The proposed solution uses atomic-layer deposited (ALD) Al2O3 as a common gate dielectric and has been demonstrated on Ge and InGaAs substrates. The CGS approach enables progressive scaling of the equivalent oxide thickness (EOT) thus opening new avenues for future generations high-performance CMOS applications.

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Recent imec news releases

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